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AMD makes official the thermal envelope of its first Fusion chips

By crispin. Original by Lionel - 08/09/2010 00:08:00 CEST - Category: PC - Source: PC Inpact

AMD continues to distill drop by drop information concerning the specifications of its future mobile chips " APU", containing two cores and a graphic part. They have announced the thermal dissipations of the first versions engraved in 40nm.

The Ontario model intended for Netbooks will have a TDP of 9W. More interesting given the portable range of Apple, the Zacate, intended for the compact ultra portables such as the MacBook Air will have a TDP of 18W. Even though it is of course necessary to wait to see the power of its cores, the graphic part appears more powerful than a 9400M, and if it shows that it can fight with Core 2 Duo, which would not be too surprising, then we would have a candidate of choice to give an update to this portable that Apple overlooked at the time of the last updates. A TDP of 18W, graphics chip included is perfect to stop this machine heating up and to ensure an interesting battery life.

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