Apple Plans Watercooling System for Notebook

Yesterday, a patent filed by Apple was made public, it describes a watercooling system dedicated to notebook:

Technically this is not a revolution, and on can notice that Apple plans to use part of the Alu LCD enclosure as a "heatsink" or exchange surface.
Based on the history of previous watercooling system used by Apple for Quad Core PM G5, we are not really enthusiastic about such technology. A large number of leaky PM G5 liquid cooling system was reported within the last 2 years, leading to rusting of metal parts, as well as the entire destruction of the motherboard.
Description of this technology is rather surprising as the new unibody MacBook models can handle heat release without problem, so it currently does not seem to require any liquid-based cooling. One should not forget that there is a 18 months delay between filing a patent and being granted for it, the patent becoming then publicly available. It could well be part of the technology developed to try to accommodate the G5 into a notebook, or plans for adopting future Intel CPU featuring dozen of cores and requiring an improved cooling system. This could also better explain the transition to Alu unibody as this material is rather good for heat transfer.