NEC joins IBM to engrave chips at 32 nm

The semiconductor industry must unceasingly improve its manufacturing techniques for chips, unceasingly seeking to engrave finer. But each new stage has a high price in R& D as well as the tooling cost of the factories, thus each new threshold is increasingly difficult to cross. If Intel or some specialists such as TSMC manage to cross a new threshold, it behoves the others to combine.
This is why IBM, who are at the cutting edge in this field has created an alliance in which one finds already great names like Toshiba, Infineon, STMicro…
NEC has announced that it joined this group and will put funds into the common pot in order to implement and to profit from engraving at 32 nm before taking part in the development of the following generations.
The first developments of 32nm technology, in comparison to the 45 nm, has the hope of increasing the frequencies by upto 35% with identical voltage or of economies of 50% in the energy for the same frequency.