IDF 2008: Impact of Nehalem in our Future Hardware

The future CPU architecture built around the Nehalem has been the key topic during the last IDF 2008. Hereafter is the roadmap of what will change in the future for our Mac.
- By the end of the year, the Mac Pro should evolve to Nehalem Xeon and its associated platform.

Beside the classical jumps in frequency, performances should dramatically increase thanks to several features:
- The QuickPath should replace the current system bus. With a larger bandwidth, it should allow a multipoint communication between all components, and in particular between CPUs.
- The memory bandwidth has also been massively improved by several innovations:
* A memory controller for each CPU, no need to go through a dedicated external chips
* Each CPU will have its own dedicated RAM modules, and could manage up to 9 units via 3 channels that can be used simultaneously.
* The use of DDR3 type memory
For notebooks, one will have to wait till mid-2009 as we already reported it, be here too, changes will be dramatic:

Intel will switch from a three chips-based motherboard architecture to a 2 chips-based model. The memory controller and the video will now be integrated directly in the CPU, thus accelerating their use and access. It will then reduce the number of printed-circuits. Such change will also improve power management. When using the notebook with less demanding tasks, the lower voltage and frequency of the CPU will have a greater impact on the battery lifetime.
The second chips. Beside the CPU will also manage inputs/outputs. For OEM and manufacturers, this new architecture will also make things easier as one will simply need to change the CPU to differentiate models, as the motherboard will have been simplified.
So, Nehalem is not only a new evolution of the Core Duo, it will bring deep changes in the architecture of our computers and should pave the way for the next decade; towards optimized chips, better usage of raw power, improved power management…