Optimize heat dissipation chips

NEC has developed new thermal probe 10 times smaller than what is currently used. The company blankets chips in order to draw up a very precise map of hot spots or cold, and optimize their operations by distributing the best workload in the most optimized areas. The ultimate goal would be to work a maximum of burden-sharing transitors to then reduce the tension and overall consumption. It is not known if it is possible to bring this technology on central processor (CPU) or graphics (GPU) chips.