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The high-speed silicon modulator could find use in various future applications. For example, a highly integrated silicon photonic circuit may provide a cost effective solution for the future optical interconnects within computers and other devices. With the demonstration of the 40 Gbps silicon modulator and the electrically pumped hybrid silicon laser, it will become possible to integrate multiple devices on a single chip (Fig. 3) that can transmit terabits of aggregate data per second in the near future – truly enabling tera-scale computing.