IBM PPC 970MP: is it censured?

Regularly, we are visiting IBM website IBM to check if a new document related to the PPC970MP were disclosed.
So, either IBM made a mistake while indexing articles, unlikely; or they have removed mentions to the non existing 970MP processor.
However, the subject of this article is really the proof that this processor is indeed hot, meaning releasing substantial amount of heat. It describes the "Use of BGA underfill to strengthen the BGA connections between the processor module and the processor card and increases long term reliability performance affected by creep and cyclic fatigue."
The complete article is available here:
BGA Solution for G5.pdf